Illinois General Assembly - Bill Status for HB2757
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 Bill Status of HB2757  99th General Assembly


Short Description:  LIENS: SUBSTITUTION OF BOND

House Sponsors
Rep. Thomas M. Bennett

Last Action
DateChamber Action
  1/10/2017HouseSession Sine Die

Statutes Amended In Order of Appearance
770 ILCS 60/23from Ch. 82, par. 23
770 ILCS 60/23.5 new
770 ILCS 60/38.1 new


Synopsis As Introduced
Amends the Mechanics Lien Act. Provides that an applicant may at any time file a petition to substitute a bond for the property subject to a lien claim under the Act with the clerk of the circuit court of the county in which the property against which the lien claim is asserted is located, or, if there is a pending action to enforce the lien claim, an applicant may timely apply to become a party to the pending action at any time before a final judgment is rendered and file a petition to substitute a bond for the property subject to the lien claim in the pending action. Defines terms. Contains notice and procedural requirements; a statement of legislative intent; and language limiting the applicability of the new provisions.

Actions 
DateChamber Action
  2/20/2015HouseFiled with the Clerk by Rep. Thomas M. Bennett
  2/20/2015HouseFirst Reading
  2/20/2015HouseReferred to Rules Committee
  3/2/2015HouseAssigned to Judiciary - Civil Committee
  3/19/2015HouseTo General Law Subcommittee
  3/27/2015HouseRule 19(a) / Re-referred to Rules Committee
  1/10/2017HouseSession Sine Die

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