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| | 104TH GENERAL ASSEMBLY
State of Illinois
2025 and 2026 HB4989 Introduced , by Rep. Kimberly Du Buclet SYNOPSIS AS INTRODUCED: | | | Creates the Data Center Heating and Cooling Act. Defines "air to water heat exchanger" and "data center". Provides that any new or existing data center in the State shall adopt a heat energy reuse plan that involves the use of an air to water heat exchanger to help heat homes and businesses in the area around the data center. Provides that any data center constructed on or after the effective date of the Act that has an aggregate demand load of 20 megawatts or more shall have a liquid cooling system, such as direct-to-chip cooling or immersion cooling, incorporated into the data center. Effective January 1, 2027. |
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| | A BILL FOR |
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| | HB4989 | | LRB104 17645 AAS 31076 b |
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| 1 | | AN ACT concerning regulation. |
| 2 | | Be it enacted by the People of the State of Illinois, |
| 3 | | represented in the General Assembly: |
| 4 | | Section 1. Short title. This Act may be cited as the Data |
| 5 | | Center Heating and Cooling Act. |
| 6 | | Section 5. Definitions. As used in this Act: |
| 7 | | "Air to water heat exchanger" means a mechanism that |
| 8 | | recaptures any heat produced into water loops, which can then |
| 9 | | be redirected to local heating systems. |
| 10 | | "Data center" has the meaning given to that term in |
| 11 | | subsection (c) of Section 605-1025 of the Department of |
| 12 | | Commerce and Economic Opportunity Law of the Civil |
| 13 | | Administrative Code of Illinois. |
| 14 | | Section 10. Data center heating and cooling mechanisms. |
| 15 | | (a) Any new or existing data center in this State shall |
| 16 | | adopt a heat energy reuse plan that involves the use of an air |
| 17 | | to water heat exchanger to help heat homes and businesses in |
| 18 | | the area around the data center. |
| 19 | | (b) Any data center constructed on or after the effective |
| 20 | | date of this Act that has an aggregate demand load of 20 |
| 21 | | megawatts or more shall have a liquid cooling system, such as |
| 22 | | direct-to-chip cooling or immersion cooling, incorporated into |