90th General Assembly Summary of HB1170    [ Home ]   [ Back ]   [ Legislation ]

Legislation:   Please enter a bill number.

House Sponsors:
RUTHERFORD-RYDER.

Short description: 
BUILD ILL BOND-AUTHORIZE-TECH                                              

Synopsis of Bill as introduced:
        Amends the Build Illinois Bond Act to reduce  bond  authorization      
   by $1.  Effective immediately.                                              
 
Last action on Bill: SESSION SINE DIE

   Last action date: 99-01-12

           Location: House

 Amendments to Bill: AMENDMENTS ADOPTED: HOUSE -   0     SENATE -   0


   END OF INQUIRY 


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